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ASE Develops 310mm Panel-Level Packaging Automation, Targeting Mass Production in First Half of Next Year
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Author：小编
ASE Semiconductor has developed the industry's first 310mm×310mm panel-level packaging automation production line, achieving seamless integration from wafer-level to panel-level packaging. It is compatible with the design specifications of the FOCoS and FOCoS-Bridge packaging platforms, helping to enhance economies of scale, and is expected to officially commence production in the first half of 2027.
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