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Sunfine New Material Technology has made an announcement revealing that, commencing from the latter half of 2025, the company has witnessed a steady increase in its order backlog for high-end chip-type VCP electroplating equipment, with initial shipments of certain equipment already underway. Presently, the company boasts a robust order backlog, predominantly encompassing VCP electroplating equipment, mSAP electroplating equipment, HVLP5 copper foil electroplating and post-treatment systems, as well as composite copper foil water electroplating apparatus. In the realm of mSAP, several of the company's specialized process chemicals have already been adopted by leading PCB manufacturers. Moreover, the company has successfully clinched orders for mSAP electroplating equipment from these premier PCB clients.
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