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BOZHON: Eutectic Die Bonder Equipment Has Been Applied in Bulk for the Mass Production of 400G/800G High-Speed Optical Modules
19 hour ago /
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Author：小编
On May 25, BOZHON stated on an interactive platform that its eutectic die bonder equipment has been applied in bulk for the mass production of 400G/800G high-speed optical modules, successfully entering the supply chains of leading domestic and foreign enterprises and being exported overseas.
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