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Samsung Electronics Achieves Milestone: Develops Prototype of 900-Layer Ultra-High Stacking 3D NAND Flash, Insider Sources Reveal
20 hour ago /
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Author：小编
Samsung Electronics has triumphantly crafted the world's inaugural prototype of a 900-layer ultra-high stacking 3D NAND flash memory. This feat was accomplished by interlinking two 450-layer 3D NAND units through the utilization of cutting-edge cell multi-layer bonding technology. Furthermore, the operational efficacy of the memory cells within this prototype has undergone thorough verification.
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