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On May 25, He Tingbo, who serves as a Director at Huawei and as the President of its Semiconductor Business Department, disclosed at the International Symposium on Circuits and Systems (ISCAS 2026) that the Kirin mobile phone chip slated for release this autumn will incorporate logical folding technology for the inaugural time, heralding a significant leap in performance. He Tingbo elaborated that the 'Kirin 2026' marks the pioneering achievement in successfully implementing logical folding technology. Over the forthcoming decade, Huawei is committed to propelling the development of comprehensive folding and multi-layer folding technologies, with a steadfast focus on continually refining full-stack performance, spanning from devices and circuits to chips and systems.
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