Samsung, SK Hynix, and Micron are ramping up their efforts in the development of DDR6 memory. Despite the fact that the JEDEC standard is still in the process of being finalized, memory manufacturers have already approached substrate suppliers to initiate design work, aiming to have test samples ready. DDR6 is anticipated to offer a substantial boost in speed, potentially reaching up to 17.6Gbps—nearly double the projected upper limit of DDR5. It is expected to hit the commercial market between 2028 and 2029. Moreover, JEDEC unveiled the LPDDR6 standard last year, outlining plans to introduce an x6 sub-channel mode with half the bit width, which could pave the way for system memory capacities of up to 512GB.
