The next-generation DDR6 memory standard for desktop and server platforms is on the horizon, with memory chip manufacturers collaborating with JEDEC to advance specification development. According to a report by South Korean media outlet The Elec, storage vendors including SK Hynix, Samsung, and Micron have initiated DDR6 design in their laboratories and are gradually coordinating module development with substrate manufacturers. This collaborative R&D effort, led by JEDEC, ensures a unified technical foundation for the new-generation memory design. The draft standard for DDR6 memory was completed by the end of 2024, with platform testing and validation expected to commence in 2026. Mass commercialization is projected for 2027, initially targeting servers and high-end computing platforms before expanding to consumer markets. DDR6 offers starting transfer rates of 8800MT/s, reaching up to 17600MT/s—approximately 2 to 3 times faster than DDR5. It adopts a 4×24-bit sub-channel design to enhance parallel processing efficiency and introduces technologies such as dynamic voltage and frequency scaling, significantly improving energy efficiency.