As the power density of high-performance computing chips continues to escalate, chip-level thermal management has emerged as a pivotal concern, directly impacting the performance and reliability of electronic systems. Two-phase cooling, which leverages the latent heat of phase change to facilitate efficient heat transfer, stands out as a vital approach for dissipating heat in electronic devices with high heat flux. Nevertheless, while traditional water-cooling solutions excel in heat exchange efficiency, they introduce risks associated with electrical conductivity. Although insulating working fluids can ensure electrical safety, they are hindered by low thermal conductivity and limited latent heat of vaporization. Consequently, enhancing the two-phase cooling capacity while maintaining electrical insulation remains a formidable challenge in current thermal management research endeavors.