According to the latest report from Moore's Law Is Dead, AMD's forthcoming server platform, the Zen 7 EPYC flagship (internally codenamed Florence), is poised to incorporate up to eight 36-core Steamboat CCDs (Core Chiplet Dies), propelling a single processor to an astonishing 288 cores. Florence will harness the power of two Dwarka I/O chips and two Mathura memory chips, all fabricated utilizing the advanced TSMC N3C process technology. Each Steamboat CCD is ingeniously constructed by stacking a Zen 7 core chip, manufactured on TSMC's cutting-edge A14 node, atop an L3 cache chip on the N4P node, with the cache chip neatly positioned beneath the core chip. This processor supports the latest PCIe 6.0 and CXL 3.2 interfaces, boasts an xGMI4-80G interconnect speed, and has a thermal design power (TDP) of up to 600W. The A0 tape-out is scheduled for October 2026, with mass production slated for mid-2028 and an official release anticipated by the end of 2028.