On April 13, Japanese semiconductor producer Rapidus declared the formal commencement of a cutting-edge semiconductor packaging process trial production line in Chitose City, Hokkaido. Serving as the linchpin of Rapidus Chiplet Solutions' R&D center, this trial production line embraces state-of-the-art technologies and employs 600mm×600mm square glass substrates to significantly elevate AI chip production efficiency. Additionally, it establishes a comprehensive analysis center to uphold stringent product quality standards. The company has set its sights on achieving large-scale mass production of 2nm process technology in the latter half of fiscal year 2027, with an initial monthly production capacity pegged at 6,000 wafers, and a phased increase to 25,000 wafers thereafter. Earlier, on April 11, Japan's Ministry of Economy, Trade and Industry sanctioned an extra 631.5 billion yen in funding for Rapidus. From fiscal year 2022 to 2026, the company has garnered a cumulative total of 2.354 trillion yen in government R&D backing. Established at the close of 2022 by eight Japanese enterprises, Rapidus is dedicated to the R&D and manufacturing of next-generation semiconductors.