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Hanmi Semiconductor to Launch Prototype of Second-Generation Hybrid Bonding Machine
1 day ago /
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Author：小编
Hanmi Semiconductor plans to launch the prototype of its second-generation hybrid bonding machine within the year and commence factory operations in the first half of 2027. The equipment will enhance precision, stability, and yield for next-generation HBM production. The company is constructing related factories and clean rooms, with a total investment of 100 billion Korean won.
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