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Industry Alert: Wafer Foundry and Packaging/Testing Costs Surge in Tandem, Prompting DDIC Suppliers to Explore Price Hikes
15 hour ago /
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Author：小编
On March 27, the latest survey conducted by TrendForce revealed that, commencing from 2025, the costs associated with semiconductor wafer foundry services, as well as backend packaging and testing processes, have been on a gradual upward trajectory. This escalation is further exacerbated by the persistent rise in raw material prices, particularly those of precious metals. Consequently, manufacturers of display driver integrated circuits (DDICs) are now grappling with substantial cost pressures. In response to these challenges, certain manufacturers have initiated negotiations with their panel customers to evaluate the feasibility of implementing product price increases.
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