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TSMC is intensifying its efforts in constructing overseas wafer fabrication plants (fabs), with the construction cycle being significantly shortened from the standard 6 quarters to just 4-5 quarters. Consequently, the overall timeline for establishing factories in the U.S. has been condensed from 3 years to a mere 1.5-2 years. Presently, the construction of the second wafer fab in Arizona, U.S., has reached completion, with expectations for 3nm mass production to kick off as early as the latter half of 2027. Additionally, Fab21 P3 is slated to enter the main system installation phase during the same period. Simultaneously, TSMC is vigorously expanding its advanced process capabilities within Taiwan, with the third phase (P3) of Hsinchu Fab20 and Kaohsiung Fab22 set to commence equipment installation in the third quarter of 2026.
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