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Yongxin Electronics Awaits You at SEMICON China 2026: FH-BSAP® 2.5D/3D Solution Unlocks a New Chapter in AI Computing
1 day ago /
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Author：小编
Mark your calendars for March 25 to 27, 2026, as SEMICON China 2026 takes center stage at the Shanghai New International Expo Centre. Under the banner of "Crossing Global Boundaries, Connecting Hearts and Chips," this premier event is set to draw over 1,500 exhibitors, sprawling across an impressive 100,000+ square meters of exhibition space. It will comprehensively cover the entire pan-semiconductor industry ecosystem, encompassing chip design, manufacturing, packaging and testing, as well as equipment and materials. Simultaneously, more than 20 insightful forums will delve into the latest advancements, including AI computing capabilities, cutting-edge manufacturing techniques, advanced packaging solutions, and domestic alternatives.
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