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Indian Government Offers US$180 Million Subsidy for Caynes’ New Chip Packaging and Testing Plant
7 hour ago /
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Author：小编
The Indian government is set to grant subsidies to Caynes for its backend semiconductor facility, a collaborative project involving local and Japanese firms. The plant is on track to begin operations by the end of this year. Under this initiative, the government will subsidize half of the project's total costs. Mitsui & Co. will take charge of sourcing raw materials and handling related logistics, while Aoi Electronics will contribute to the production line setup. Furthermore, Mitsui & Co. is exploring potential collaboration in cold chain logistics and has already signed a share acquisition and investment exploration agreement. This move underscores India's substantial commitment to bolstering its chip manufacturing sector.
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