In a recent advancement, the research team helmed by Associate Professor Tian He from Tsinghua University's School of Integrated Circuits, in tandem with Professor Ren Tianling's group and additional collaborators, introduced a pioneering, foundry-centric, algorithm-guided adaptive optimization approach tailored for the production of two-dimensional chips. Leveraging this innovative strategy, the team successfully constructed a fully-interconnected microprocessor utilizing two-dimensional materials. The methodology encompasses iterative refinement through six sequential phases: circuit design, layout planning, material cultivation and transfer, device fabrication, and chip evaluation. Ultimately, they achieved the fabrication of a fully-interconnected two-dimensional processor, paving the way for scalable applications across diverse functionalities and sizes of two-dimensional circuits.