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Recently, a groundbreaking collaborative effort has unfolded at Tsinghua University, where the research group helmed by Associate Professor Tian He and the team led by Professor Ren Tianling, both hailing from the School of Integrated Circuits, have joined forces to introduce an innovative, foundry-centric, algorithm-driven adaptive optimization strategy tailored specifically for the fabrication of two-dimensional (2D) chips. Leveraging this pioneering approach, they have successfully crafted a fully interconnected microprocessor utilizing 2D materials. Through the iterative refinement of multiple stages—spanning circuit design, layout planning, material growth and transfer, device fabrication, and chip testing—this strategy adeptly sidesteps common pitfalls such as device malfunction and inconsistency, thereby markedly enhancing chip yield.
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