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Major Leap Forward at AOS Songjiang Plant: Commencement of the World’s Pioneering Mass Production of CSP35 Micron Power Semiconductor Ultra-Thin Wafers
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Author：小编
The wafer undergoes a grinding process to achieve a remarkable thickness of just 35 microns, equivalent to a mere half of a human hair's diameter. Nexperia (Shanghai) Co., Ltd., a subsidiary of Alpha and Omega Semiconductor (AOS), has successfully set up the world's inaugural production line dedicated to the processing, packaging, and testing of CSP35 micron power semiconductor ultra-thin wafers. This significant advancement substantially diminishes the on-resistance and thermal resistance of power chips, thereby boosting device energy efficiency and heat dissipation capabilities. It provides crucial support for high-power-density applications, including new energy vehicles and 5G base stations.
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