The quest to make intelligent devices more flexible has hit a significant snag: traditionally, chips have been rigid, posing a major obstacle to achieving true flexibility. However, the research team led by Peng Huisheng and Chen Peining at Fudan University has made a groundbreaking advancement. They have successfully embedded large-scale integrated circuits within elastic polymer fibers, resulting in the creation of an innovative 'fiber chip'. This novel invention offers a fresh approach to overcoming the flexibility challenges faced by intelligent devices. Their remarkable achievement was featured in the prestigious international journal Nature on January 22nd.
