On January 22, an ambitious concept—building high-density integrated circuits within fibers even thinner than a human hair—has been transformed into reality. The research team, led by Huisheng Peng and Peining Chen from the Institute of Fiber Electronic Materials and Devices and the Department of Polymer Science at Fudan University, has successfully developed the world's inaugural 'fiber chip'.

This innovative chip not only demonstrates information processing capabilities on par with certain classic commercial chips but also stands out with its remarkable flexibility. It can easily adapt to complex deformations, including stretching and twisting, and is even weavable. Such unique features position it as a pivotal technological advancement expected to significantly bolster future industries, such as brain-computer interfaces, electronic textiles, and virtual reality.

At the stroke of midnight Beijing Time on January 22, this groundbreaking and original achievement, which diverges from the traditional silicon-based chip framework, was published in the internationally esteemed academic journal Nature.