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TSMC Increases Investment in Advanced Packaging as Apple's A20 Chip May Adopt WMCM Technology
2 week ago /
Read about 0 minute
Author：小编
TSMC is increasing its investment in advanced packaging technology as Apple plans to adopt the 2nm process for the A20 chip to be featured in the iPhone 18 and upgrade its packaging technology from InFO to WMCM. TSMC is constructing a new WMCM production line at its Chiayi AP7 factory to meet Apple's production demands.
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