It required almost a decade for High Bandwidth Memory (HBM) to emerge as a central focus within the semiconductor industry. Now, the commercialization of its subsequent technology, High Bandwidth Flash (HBF), is gathering momentum. According to reports from international media outlets like The Korea Economic Daily, SK Hynix is partnering with SanDisk to drive forward the development of HBF standards. They have outlined plans to unveil HBF1 samples as early as 2026, which will incorporate 16-layer NAND flash memory stacking. HBF attains high bandwidth by vertically stacking NAND flash memory. While its latency is somewhat higher compared to HBM, its storage capacity can surpass that of HBM by over tenfold, all at a lower cost per unit. Tailored specifically for AI inference tasks, HBF operates in conjunction with HBM to overcome the so-called 'memory wall.' Projections indicate that the market size for HBF will outstrip that of HBM by 2038. Samsung Electronics and SanDisk have ambitions to integrate HBF technology into products from NVIDIA, AMD, and Google as early as late 2027 or early 2028.