The global semiconductor manufacturing technology is marching towards a new milestone, with TSMC's 2nm (N2) process technology showcasing significant market allure. Its research and development efforts, along with progress in mass production, are at the forefront. During the same period, the tape-out volume for this process has soared to 1.5 times that of the 3nm technology, underscoring the global chip design firms' urgent need for next-generation process technologies. TSMC's initial monthly production capacity for the 2nm process is around 35,000 wafers. It is anticipated to climb to 140,000 wafers by the end of 2026, exceeding previous market expectations. Apple, TSMC's largest client for the 2nm process, has reserved over 50% of the initial production capacity. This allocation will be used for manufacturing chips for the iPhone 18 series and the chips needed for the OLED version of the MacBook Pro. Other vendors, such as Qualcomm and MediaTek, are also eagerly jumping on the bandwagon, planning to introduce chip products leveraging TSMC's 2nm process. Furthermore, TSMC's 2nm process dominates the AI accelerator market, with projected revenue in the third quarter of 2026 set to surpass the combined revenue of the 3nm and 5nm processes.