On January 6, during the Consumer Electronics Show (CES), AMD's CEO, Lisa Su, announced that the company's upcoming next - generation AI chip, the MI455 GPU, will be produced using 2 - nanometer and 3 - nanometer manufacturing processes. This chip will incorporate cutting - edge packaging technology and come equipped with High - Bandwidth Memory 4 (HBM4). Moreover, it will be seamlessly integrated with EPYC CPUs.

The next - generation AI rack, dubbed the Helios rack, is set to house 72 GPUs. By connecting thousands of these Helios racks, it becomes possible to build large - scale AI clusters.

In addition, AMD is also in the process of developing the MI500 series chips, which will leverage a 2 - nanometer process. It is anticipated that when the MI500 series chips hit the market in 2027, AMD will have achieved a staggering 1000 - fold increase in the performance of its AI chips over a span of just 4 years.