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NVIDIA and AMD Are Assessing Intel's 14A Process
4 week ago /
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Author：小编
Recently, industry behemoths like Marvell, MediaTek, Google, and Meta have displayed a keen interest in Intel's EMIB (Embedded Multi-die Interconnect Bridge) advanced packaging technology. Given the constrained capacity of TSMC's CoWoS (Chip-on-Wafer-on-Substrate) packaging, these firms are now evaluating EMIB as a viable alternative for packaging AI accelerators, ASIC (Application-Specific Integrated Circuit) chips, network processors, and various other products. Their objective is to ease supply chain pressures and diminish dependence on a single supplier.
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