On December 19, Lion Microelectronics disclosed during an institutional investor briefing that its production capacity for 12-inch heavily doped silicon wafer series is undergoing a swift expansion, with the current operational utilization rate hovering around 80%. The company's 12-inch silicon wafers are now adept at fulfilling the requirements for both logic and memory circuits at technology nodes of 14nm and beyond. Moreover, they cater to the needs for image sensor devices and power devices demanded by customers operating at corresponding technology nodes. These wafers have successfully infiltrated the supply chains of certain memory chip customers.

Furthermore, Lion Microelectronics' lightly doped polished wafer product line is set to capitalize on its epitaxial technology prowess, concentrating on the development of products such as BCD lightly doped boron silicon wafers and CIS lightly doped boron silicon wafers. The company is also deeply committed to the research and development of lightly doped silicon wafers essential for cutting-edge manufacturing processes. It places a stronger emphasis on elevating the technological prowess and quality benchmarks of its products, rather than actively participating in price wars.