On December 15, JingJiawei disclosed that its wholly-owned subsidiary, Wuxi Chengheng Microelectronics Co., Ltd., had triumphantly advanced through crucial milestones in the development of its independently designed edge AI SoC chip, the CH37 series. These milestones encompassed tape-out (the process of finalizing the chip design for manufacturing), packaging (encasing the chip for protection and integration), wafer return (receiving the manufactured silicon wafers), and successful lighting-up (initial power-on and functional verification).
Initial tests have demonstrated that the chip's fundamental functions and core performance indicators align with the predetermined design specifications, signifying a pivotal achievement in the project's timeline. Moving forward, the focus will shift towards power efficiency optimization and exhaustive performance evaluations to pave the way for an early entry into mass production.
This cutting-edge chip integrates advanced processing units, including a CPU (Central Processing Unit), GPU (Graphics Processing Unit), and NPU (Neural Processing Unit), specifically tailored to cater to the burgeoning markets of embodied intelligence and edge computing. Its versatility enables deployment across a wide array of applications, ranging from robotics and AI-powered boxes to smart terminals and unmanned aerial vehicle (UAV) pods.
