Search
TSMC Faces Tight Advanced Packaging Capacity; NVIDIA Secures Over Half of Next Year's Allocation
2025-12-11 /
Read about 0 minute
Author：小编
Recent reports indicate that TSMC's current advanced packaging capacity is fully booked, with NVIDIA securing more than half of the available allocation for the coming year. TSMC's CoWoS (Chip-on-Wafer-on-Substrate) packaging technology has garnered significant industry favor. However, due to the escalating packaging demands that far outpace TSMC's current production capabilities, the company has opted to outsource a portion of its orders to fellow Taiwan-based enterprises, namely ASE (Advanced Semiconductor Engineering) and SPIL (Siliconware Precision Industries), in an effort to alleviate the mounting pressure.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
