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Recently, Beihang University has achieved a remarkable milestone in the realm of integrated circuits. A research team, spearheaded by Professor Zhang Hui and Associate Professor Wu Lianbo from the School of Integrated Circuit Science and Engineering at Beihang University, worked in tandem with the Tiantmushan Laboratory and the research group led by Special Researcher Ye Xiuzhu from the Beijing Institute of Technology. Together, they successfully developed a through-wall radar SoC chip.
This groundbreaking accomplishment has been officially accepted for presentation at the 2026 IEEE International Solid-State Circuits Conference (ISSCC). Notably, this marks the first time Beihang University will be featured as the primary institution responsible for a paper at this prestigious conference, a significant leap forward given its previous lack of publications in this arena.
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