SK Hynix is set to introduce its new generation of high-speed DRAM offerings at the 2026 International Solid-State Circuits Conference (ISSCC). Among these, the most eye-catching is the 24Gb GDDR7 chip, which is capable of reaching transfer rates as high as 48Gb/s. As reported by South Korea's ZDNet, this chip leverages a symmetric dual-channel architecture along with an enhanced internal interface. This innovation enables it to shatter the industry's previously projected speed ceiling of 32 to 37Gb/s, marking an impressive surge in transmission speed of over 70%.
