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On November 20, Kaifa Technology highlighted in its announcement on the investor relations activities record sheet that the storage chip packaging sector is characterized by relatively high technical barriers. As a frontrunner in China's high-end storage chip packaging and testing industry, Kaifa Technology prides itself on its seasoned R&D and engineering team, proficient in advanced multi-layer stacking packaging techniques and test software development technologies. Presently, the company's packaging and testing facilities in both Shenzhen and Hefei are running at full throttle, with plans to ramp up production in response to escalating customer demand. Kaifa Technology remains vigilant in tracking customer trends, making capacity adjustments that align with its long-term strategic vision, guided by precise evaluations of industry trends and market dynamics.
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