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Chinese Academy of Sciences Achieves Swift and Successful Fabrication of a 4-Inch 'Free-Standing' Diamond Ultra-Thin Film
2025-11-15 /
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Author：小编
Diamond stands out as a pivotal material for heat dissipation in next-generation high-power chips, owing to its exceptional thermal conductivity (ranging from 2000 to 2200 W/m·K) and a low coefficient of thermal expansion. When a chip is directly attached to a diamond substrate, it can substantially decrease the near-junction thermal resistance and lower the junction temperature, thereby boosting the chip's performance and reliability. This method is widely recognized as an optimal thermal management strategy for high-performance computing and 3D packaging applications.
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