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TI’s Second Assembly and Test Facility in Malaysia Commences Operations, Packaging Billions of Chips Annually
1 day ago /
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Author：小编
Global analog semiconductor powerhouse Texas Instruments (TI) has announced the official start of operations at its second assembly and test facility, TIEM2, located in Malacca, Malaysia. Positioned adjacent to TI’s existing plant, the new facility is projected to package and test billions of semiconductor chips each year, focusing on both analog and embedded processing chips used in applications such as electric vehicles. This strategic expansion is part of TI’s broader initiative to bolster its global supply chain network, with the goal of meeting 90% of its assembly and test needs by 2030.
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