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At the 8th China International Import Expo, the Dutch company ASML took center stage by unveiling two cutting-edge lithography machines: the TWINSCAN XT:260 and the TWINSCAN NXT:870B. Rather than being tailored for conventional chip lithography processes, these two innovative machines are purpose-built for sophisticated packaging domains, notably 3D packaging. The TWINSCAN XT:260 marks ASML's maiden foray into a lithography system exclusively crafted for the advanced packaging sector. It boasts expansive field exposure capabilities and delivers a remarkable 4-fold surge in production efficiency when juxtaposed with existing models. Meanwhile, the TWINSCAN NXT:870B is fortified with upgraded optical components and a state-of-the-art magnetic levitation platform, enabling it to churn out over 400 wafers on an hourly basis.
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