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Xingsen Technology: CSP Package Substrates in High Demand with Full Order Books; Newly Expanded Production Capacity Stepping into Full Swing
2025-10-13 /
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Author：小编
On October 13, Xingsen Technology disclosed on its interactive engagement platform that, propelled by the resurgence in the downstream memory chip and consumer electronics sectors, the company is currently inundated with orders for CSP (Chip Scale Package) package substrates. The newly augmented production capacity is now transitioning into the full-scale mass production phase, signaling a promising outlook for the company's overall business performance. In parallel, the FCBGA (Flip Chip Ball Grid Array) package substrate project is making strides in market penetration and order procurement.
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