Amkor Technology, the globe's second-largest provider of semiconductor assembly and testing services, has officially commenced the construction of its cutting-edge packaging and testing campus in Peoria, Arizona, United States. Initially earmarked for a $2 billion investment, the project has undergone a strategic shift, opting for a larger plot of land. This adjustment has prompted a decision to scale up the cleanroom facilities and concurrently plan for a Phase II expansion, elevating the total investment to $7 billion (roughly equivalent to RMB 49.94 billion). Upon full completion, the combined cleanroom space across both phases will span 750,000 square feet (approximately 70,000 square meters), and is projected to generate 3,000 high-caliber employment opportunities. The inaugural phase of the factory is slated for completion by mid-2027, with operations commencing in early 2028. The campus is poised to forge a synergistic alliance (The term "synergistic" aptly captures the collaborative and mutually beneficial nature of the relationship, though "complementary" or "supportive" could also be viable alternatives depending on the specific context) with leading-edge process wafer fabrication facilities like TSMC and Intel, predominantly offering packaging and testing solutions for esteemed clients such as Apple and NVIDIA.