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Mass Production Plan Advances Smoothly, with Intel's 18A Process Attaining Record-Low Defect Density
2025-10-10 /
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Author：小编
At the Tech Tour event, Intel unveiled the most recent advancements in its 18A process, revealing that the defect density of this process has plummeted to an unprecedented low. This development signals its readiness for extensive mass production. Defect density serves as a crucial metric for assessing the maturity level of chip manufacturing processes. Specifically, it denotes the quantity of defects present per unit area on a chip wafer. A high defect density can potentially result in aberrant chip functionalities, thereby disrupting the normal performance of transistors, interconnects, and vias.
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