On September 30, analysts from UBS highlighted in a research report that TSMC might reduce the time required to manufacture advanced chips in the United States. This move is seen as a response to the U.S. government's push to expedite chip localization efforts. The analysts are of the opinion that the capacity expansions undertaken by TSMC and Intel in the U.S. are projected to adequately cater to the domestic demand for cutting-edge logic chips within the United States from 2029 to 2030. However, it's worth noting that this projection does not encompass the most advanced process nodes. Additionally, it is anticipated that relocating the memory chip supply chain to the United States will be a more time-consuming endeavor.