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On September 29, the headquarters and industrialization base project for Kangying Semiconductor Memory Chips officially got underway in the Donggang district of Quzhou Smart Manufacturing New City. With a total investment of around 2.3 billion yuan and encompassing a construction area of 250,000 square meters, this project spans various crucial stages. These include wafer lapping and dicing, high-end packaging and testing, as well as module product manufacturing. Its overarching goal is to establish an integrated manufacturing hub that covers the entire industry chain.
The project will be implemented in two distinct phases. The initial phase is projected to initiate trial production in the fourth quarter of 2026. Meanwhile, the second phase will place a strong emphasis on the industrial application of next-generation memory technologies.
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