On September 25, 2025, at the Snapdragon Summit, Qualcomm officially took the wraps off the Snapdragon X2 Elite Extreme chip. This chip is tailored for the ultra-high-end PC market and is mainly aimed at performance-demanding applications, including professional media content creation and intricate data analysis. Manufactured using TSMC's cutting-edge 3nm process technology, the chip boasts 18 cores with a maximum clock speed of 5GHz. The third-generation Qualcomm Oryon CPU is engineered to deliver performance that's up to 75% higher than that of competing products, all while maintaining the same power consumption levels. Furthermore, the chip integrates a newly designed Adreno GPU architecture. This architecture offers a remarkable 2.3 times greater performance per watt compared to the previous generation. The GPU is capable of supporting triple 5K 60Hz displays and is compatible with DirectX12.2 Ultimate. When it comes to memory, the chip supports LPDDR5X memory running at 9523 MT/s. It provides a bandwidth of 228GB/s and can accommodate memory capacities exceeding 128GB. The NPU (Neural Processing Unit) in this chip leverages the world's fastest NPU for laptops, delivering an impressive 80 TOPS (Tera Operations Per Second) of computing power. This represents a 78% improvement over the previous-generation platform. According to Cinebench 2024 test data, the Snapdragon X2 Elite Extreme achieves a score of 162 points in single-thread performance and 1968 points in multi-thread performance. On average, its single-thread performance is 34% higher than that of the AMD Ryzen AI 9 HX 370, and its multi-thread performance is 55% higher. When compared to the Intel Core Ultra 9 288V, it offers 31% higher single-thread performance and a staggering 234% higher multi-thread performance.