On September 10, 2025, the SEMI-e Shenzhen International Semiconductor Exhibition and the 2025 Integrated Circuit Industry Innovation Exhibition kicked off at the Shenzhen World Exhibition & Convention Center. Organized jointly by the CIOE China International Optoelectronic Exposition and the Integrated Circuit Industry Technology Innovation Alliance, this grand exhibition boasts an impressive scale, covering an area exceeding 300,000 square meters. It has successfully drawn the participation of over 5,000 high-caliber exhibitors, spanning the entire semiconductor supply chain. These exhibitors represent key sectors such as chip design, manufacturing, packaging and testing, materials, and equipment.

As a seasoned and deeply engaged player in the industry, Tianxin Interconnection took the opportunity to display its cutting-edge packaging and system integration solutions, along with its integrated circuit testing solutions. By capitalizing on its advanced platforms, including Wafer-Level Packaging (WLP), System-in-Package (SiP), and Fan-Out Panel-Level Packaging (FOPLP), the company is well-positioned to offer one-stop services tailored to the needs of high-end medical applications, automotive electronics, consumer electronics, and other relevant fields.