A groundbreaking team, led by Professor Wang Xingjun of Peking University and Professor Wang Cheng of City University of Hong Kong, has successfully developed an ultra-wideband optoelectronic fusion chip. This innovative chip surpasses the constraints of traditional hardware's fixed frequency bands, facilitating high-speed wireless communication across the entire spectrum, spanning from microwaves to terahertz frequencies. Across all frequency bands, the transmission rate can soar to 50-100Gbps, vastly outperforming 5G's capabilities by two to three orders of magnitude. Its reconfigurable optoelectronic fusion architecture boasts ultra-low noise performance, effectively mitigating noise accumulation in high-frequency signals and supporting dynamic spectrum management. This remarkable achievement lays the critical hardware foundation for 6G's pervasive connectivity and intelligent networks.