Wuhan Sipowave Intelligent Technology Co., Ltd. has successfully closed its angel round of financing, with Optics Valley Capital taking the lead and Wuhan Innovation Institute Investment and Jiangcheng Innovation Fund also participating. The proceeds from this funding round will primarily be allocated to enhancing the technological capabilities of wafer ultrasonic testing equipment, augmenting the team, and expanding market reach. Established in November 2023, Sipowave leverages its robust industry-academia-research collaboration with Huazhong University of Science and Technology and Wuhan Institute of Intelligent Manufacturing. The company's flagship product, the C-SAM system, excels in efficiently detecting defects during wafer stacking processes, offering performance on par with international standards while providing cost and customization benefits. Already, Sipowave has expressed cooperation intentions with several enterprises. Moving forward, Sipowave Intelligent intends to concentrate on broadening its applications in advanced packaging scenarios, such as 3D ICs and Chiplets, aiming to complete domestic verification and mass production delivery of multiple equipment within the next two years. Additionally, the company plans to establish R&D and marketing centers in Wuhan and Shenzhen.