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Anticipated Major Upgrade for Huawei's Kirin Chips: Reports Indicate Domestic N+3 Process Technology on the Horizon
2025-08-18 /
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Author：小编
Tech enthusiasts have uncovered that the rumors surrounding the domestic N+3 process technology are indeed accurate. With a calculated wiring density of 125MTr/mm² based on the patent index H210G56, this process is on par with industry-standard 5nm processes. SMIC's independently developed N+3 process boasts a transistor density of 125MTr/mm², closely matching TSMC's 5nm process level, representing a significant leap forward in domestic advanced semiconductor manufacturing. Should Huawei Hisilicon adopt this technology to resume production of Kirin chips, it is anticipated that their performance will rival that of Qualcomm's Snapdragon 888, effectively catering to the demands of the mid-to-high-end smartphone market.
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