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SYE has unveiled plans to invest approximately 1.9 billion yuan in the establishment of a smart manufacturing project dedicated to high-layer computing power circuit boards. An additional investment of around 1.75 billion yuan is foreseen, with the entire project anticipated to be completed within a timespan of 2.5 years. The initiative is set to commence trial production in 2026 and 2027, specifically targeting the mid-to-high-end market demands for servers, advanced network communications, and AI computing power. Funding for this ambitious project will be sourced from self-owned or self-raised capital. Nevertheless, the execution of the project may encounter potential uncertainties, including policy adjustments, approval risks, and the possibility of market demand falling short of expectations.
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