Search
Samsung Injects $170 Million into Yokohama Chip Packaging R&D Hub, Heightening Rivalry with TSMC
2025-08-14 /
Read about 0 minute
Author：小编
Samsung Electronics is set to invest $170 million in the establishment of a cutting-edge chip packaging research and development (R&D) center in Yokohama, Japan, with an anticipated opening date in 2027. This initiative aims to deepen collaboration with Japanese material and equipment suppliers, thereby bolstering Samsung's competitiveness in the premium packaging market, particularly in the realm of AI chip manufacturing. Although Samsung currently trails TSMC in the packaging sector, it has recently secured a major chip foundry order from Tesla. Market projections suggest that the advanced packaging market is on the brink of substantial expansion.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
