As individual chip dimensions inch closer to the limitations of photomasks, advanced packaging technology has emerged as the linchpin for integrating multiple dies into high-performance chips. Samsung Electronics is now pioneering the development of System-on-Package (SoP) packaging technology tailored for 415mm×510mm panels, aiming to secure a competitive edge against Intel and TSMC in the ultra-large-scale chip system integration market. This innovative approach eliminates the need for PCB substrates or silicon interposers, instead utilizing RDL redistribution layers for communication, thereby facilitating the integration of larger chip systems. Nevertheless, SoP technology must still navigate challenges like ensuring stability in large-scale operations and mitigating edge warpage. This strategic move is also viewed as Samsung's bid to capture packaging orders for Tesla's third-generation AI chips.