A research report by CITIC Securities anticipates an accelerated implementation of orthogonal backplane solutions for printed circuit boards (PCB) within server cabinets, driven by the escalating demand for greater computing power, speed, and density. These solutions offer superior bandwidth, integration, and thermal dissipation capabilities, which could substantially elevate the unit value of PCBs and further tighten the industry's long-standing supply-demand dynamics. Manufacturers possessing advanced technological capabilities are poised to reap the earliest benefits. Investors are recommended to target industry leaders with substantial involvement in the AI computing power supply chain and a proven track record of customer adoption.
