On October 29, news emerged that, driven by the ever-increasing demand for AI computing power, Shenghong Technology's high-end PCB (Printed Circuit Board) orders and delivery status have captured substantial market interest. The company maintains a bullish outlook on future orders and demand, currently enjoying a robust order backlog with order visibility soaring to an all-time high. Orders for high-end products, including high-layer, high-level HDI (High-Density Interconnect), and mSAP (Modified Semi-Additive Process), have been booked all the way through to 2027, providing clear order and demand backing for the company's expanded production capabilities. Shenghong Technology disclosed that it plans to broaden its customer base by over 50 new clients in the first half of 2026, with more than half of them being high-end clients operating within the AI sector. Some major clients have already commenced mass production for their next-generation products.