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Qualcomm has forged a partnership with Amazon, aiming to jointly establish AI data center infrastructure and devise optical interconnect solutions capable of reaching speeds up to 1.6T. This initiative is designed to cater to the escalating scale and bandwidth requirements of AI infrastructure. Leveraging Qualcomm's cutting-edge SerDes (Serializer/Deserializer) and optical DSP (Digital Signal Processing) technologies, the collaboration will focus on developing high-performance optical connectivity solutions. Furthermore, as part of this collaborative effort, Qualcomm intends to intensify its utilization of AWS's AI infrastructure, encompassing Amazon Bedrock. This move is set to bolster electronic design automation workloads and expedite chip design cycles.
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